PROCEDE DE REALISATION D'UN BOITIER HERMETIQUE DESTINE A L'ENCAPSULATION D'UN DISPOSITIF IMPLANTABLE ET BOITIER CORRESPONDANT.

摘要

The invention relates to a method for manufacturing a thin airtight housing, which includes: (a) providing a first element in which a recess is made; (b) forming a solder joint in said recess, said joint being at least partially inserted in said recess; (c) placing a second element opposite said first element and said joint; (d) forming a first airtight seal between the first and second elements in order to assemble same and form an assembly; (e) placing a cover on top of said assembly; and (f) forming a second airtight seal between said assembly and said cover.