METHOD OF FORMING A MICRO LED STRUCTURE AND ARRAY OF MICRO LED STRUCTURES WITH AN ELECTRICALLY INSULATING LAYER

摘要

A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment an electrically insulating layer is utilized as an etch stop layer during etching of a p n diode layer to form a plurality of micro p n diodes. In an embodiment an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.