METHODS OF CROSS-COUPLING LINE SEGMENTS ON A WAFER

摘要

A method is provided for fabricating cross-coupled line segments on a wafer for use, for instance, in fabricating cross-coupled gates of two or more transistors. The fabricating includes: patterning a first line segment with a first side projection using a first mask; and patterning a second line segment with a second side projection using a second mask. The second line segment is offset from the first line segment, and the patterned second side projection overlies the patterned first side projection, and facilitates defining a cross-stitch segment connecting the first and second line segments. The method further includes selectively cutting the first and second line segments in defining the cross-coupled line segments from the first and second line segments and the cross-stitch segment.

主权项

1. A method comprising:
fabricating a structure comprising cross-coupled line segments on a wafer, the fabricating comprising:
patterning a first line segment with a first side projection therefrom using a first mask;patterning a second line segment with a second side projection therefrom using a second mask, the second line segment being offset from the first line segment, and the patterned second side projection overlying the patterned first side projection and facilitating defining a cross-stitch segment connecting the first and second line segments; andselectively cutting the first and second line segments in defining the cross-coupled line segments from the first and second line segments and the cross-stitch segment.