METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

[Problem] To provide a method for manufacturing an electronic component, comprising insert-molding a substrate in which a minute metal conductor is embedded. [Solution] Masking tape is affixed to a metal plate as a hoop base material, the surface of the metal plate exposed from an open part of the mask is irradiated with vacuum ultraviolet light and the surface of the metal plate is activated, and an insulating resin layer and an adhesive resin layer are formed on the activated portion. A metal conductor is then punched out from the metal plate and bent. The metal conductor having undergone bending is installed in a die, a molten resin is injected therein, and a substrate such as a housing is molded.