| 摘要 |
According to the present invention, disclosed is a polishing apparatus which can perform multi-stage polishing of a substrate of a wafer or the like. The polishing apparatus comprises: a plurality of polishing tables for supporting each polishing pad; a plurality of polishing heads for pressurizing the substrate to the polishing pad; and a transfer device for transferring the substrate to at least two heads among the polishing heads. The polishing heads have structures different from each other. |
