发明名称 ELECTRONIC COMPONENT BUILT-IN PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component built-in printed circuit board and a method for manufacturing the same.SOLUTION: An electronic component built-in printed circuit board comprises: a core in which a cavity is formed; an electronic component inserted into the cavity, and having rough surfaces formed on surfaces of external electrodes provided at both side parts and low rough surfaces formed at parts of the rough surfaces; an insulation layer which is laminated on an upper part and a lower part of the core and is joined to an outer peripheral surface of the electronic component inserted into the cavity; and an external circuit pattern provided on the insulation layer.
申请公布号 JP2015179879(A) 申请公布日期 2015.10.08
申请号 JP20150134194 申请日期 2015.07.03
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 YI SUN-UN;SIN I NA;JEONG YEOL GYU;LEE DOO HWAN
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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