ALUMINUM ALLOY PLATE HAVING EXCELLENT MOLDABILITY AND BAKE HARDENING PROPERTIES

摘要

The purpose of the present invention is to provide an aluminum alloy plate capable of having a 0.2% proof stress during molding of no more than 110 MPa and a 0.2% proof stress after BH of at least 170 MPa. The present invention pertains to an aluminum alloy plate including, in mass%, 0.2%-1.0% Mg and 0.2%-1.0% Si, fulfilling {(Mg content)+(Si content)}=1.2%, having a 20-50 µW/mg high exothermic peak within a temperature range of 230-330°C in a differential scanning calorimetry curve, and having both excellent moldability and excellent bake hardening properties.