发明名称 |
BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE INTEGRATED IN LONGITUDINAL DIRECTION |
摘要 |
PROBLEM TO BE SOLVED: To provide a backside illuminated image sensor device integrated in a longitudinal direction.SOLUTION: A backside illuminated image sensor includes a photodiode and a first transistor which is located in a first chip. The first transistor is electrically connected to the photodiode. The backside illuminated image sensor furthermore includes a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip. The second chip is laminated on the first chip, and the third chip is laminated on the second chip. The logic circuits, the second transistor and the first transistor are connected to each other via a plurality of bonding pads and penetration vias. Input/output terminals of the second chip are connected to the first chip via the penetration vias and interconnection metal wirings embedded in the second chip, and the interconnection metal wirings are interposed in the penetration vias. |
申请公布号 |
JP2015179859(A) |
申请公布日期 |
2015.10.08 |
申请号 |
JP20150098629 |
申请日期 |
2015.05.13 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTUARING CO LTD |
发明人 |
WANG TZU-JUI;CHEN SZU-YING;LIU JEN-CHENG;YAUNG DUN-NIAN;LIU PING-YIN;CHAO LAN-LIN |
分类号 |
H01L27/14;H01L21/3205;H01L21/768;H01L23/522;H01L27/146;H04N5/369;H04N5/374 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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