| 摘要 |
A printed wire board unit is provided with a first printed wire board and a second printed wire board which is bonded on the first printed wire board. The first printed wire board has, on the top surface thereof, top surface electrodes to which the second printed wire board is bonded. The second printed wire board is provided with: mounting electrodes disposed on the top component-side surface thereof on which electronic components are mounted; inter-layer bonding electrodes which electrically connect bonding electrodes to mounting electrodes; and bonding electrodes which are disposed on the rear surface opposite the top surface and which are integrally bonded and electrically connected, by soldering, to the top surface electrodes of the first printed wire board. |
