| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin sheet which allows for stable manufacturing of a high quality electronic component package, without causing any variation in a resin composition even in the case of large area resin sealing, and to provide a method of manufacturing an electronic component package using the same.SOLUTION: A thermosetting resin sheet in B stage state contains an inorganic filler, and has a projection area of 31400 mmor more in plan view. |
