发明名称 ULTRASONIC PROBE, CONNECTION COMPONENT FOR ARRAY ELEMENTS AND ULTRASONIC IMAGING SYSTEM THEREOF
摘要 A connection component for array elements in an ultrasonic probe comprises a first-layer body and a second-layer body, wherein the second-layer body is connected with the first-layer body, and an area of the second-layer body is smaller than an area of the first-layer body. A region in the first-layer body that extends beyond the second-layer body is provided with at least one first-layer conductive element penetrating through the first-layer body. A lower surface of the second-layer body is provided with at least one second-layer conductive element penetrating through the second-layer body and the first-layer body. A signal transmission line is connected to the array elements by the first-layer conductive elements and the second-layer conductive elements. The connection component for array elements is in a stepped shape. The signal transmission line is connected to an array element assembly through the stepped connection component for array elements to provide sufficient space.
申请公布号 US2015282785(A1) 申请公布日期 2015.10.08
申请号 US201514744799 申请日期 2015.06.19
申请人 SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD. 发明人 Chen Zhenyu;Tang Ming
分类号 A61B8/00;A61B8/14 主分类号 A61B8/00
代理机构 代理人
主权项 1. A connection component for array elements in an ultrasonic probe, comprising: a first-layer body, which has a first upper surface and a first lower surface; a second-layer body, which has a second upper surface and a second lower surface, wherein the second upper surface is in contact with the first lower surface, an area of the second upper surface is smaller than an area of the first lower surface, a region in the first lower surface that extends beyond the second upper surface forms a first-layer wiring connection region, and the second lower surface forms a second-layer wiring connection region; a first-layer conductive element, which is arranged on the first-layer wiring connection region, and extended to the first upper surface of the first-layer body by penetrating through the first-layer body; and a second-layer conductive element, which is arranged on the second-layer wiring connection region, and extended to the first upper surface of the first-layer body by penetrating through the second-layer body and the first-layer body.
地址 Shenzhen CN