| 摘要 |
The present invention relates to a substrate treatment apparatus which supplies a mixed liquid to a substrate by mixing sulfuric acid and hydrogen peroxide and includes: a supply part including a sulfuric acid supply part for supplying the sulfuric acid and a hydrogen peroxide supply part for supplying the hydrogen peroxide; a plurality of mixing parts which mixe the sulfuric acid and the hydrogen peroxide supplied from the supply part; and a substrate treatment part for treating the substrate with the mixed liquid provided from the mixing part. The mixing part is inputted with a parameter influencing on the condition of the mixed liquid in advance, and can change the condition of the mixed liquid by switching of a switch. The substrate treatment method of the present invention supplies the mixed liquid to the substrate by mixing the sulfuric acid and the hydrogen peroxide, and includes the steps of: being inputted with the parameter influencing on the condition of the mixed liquid in advance; controlling flux of the sulfuric acid and the hydrogen peroxide in order to supply the mixed liquid of the given condition; and controlling the flux of the sulfuric acid and the hydrogen peroxide in order to supply the mixed liquid of the given condition which is changed by switching of the switch if the condition of the mixed liquid is changed. |
