| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing method of workpieces capable of reducing polishing processing time.SOLUTION: The polishing method uses a polishing device 1 comprising: a chuck table 50; polishing means 60; polishing feed means 70; and thickness measurement means 90 for polishing a workpiece W having variation of inner surface thickness. The polishing method comprises a first polishing step which performs polishing feed of a polishing grinder 63a of a polishing wheel at first feed speed toward the workpiece W held on a holding face 50a of the chuck table 50, and polishes until whole surface of the surface Wa of the workpiece W is polished, and a second polishing step which decelerates the polishing feed speed to second feed speed slower than the first feed speed, after performing the first polishing step, and further polishes the workpiece W. During polishing in the first polishing step, it is determined that the whole surface of the surface Wa of the workpiece W is polished when variation of the thickness of the workpiece W measured by the thickness measurement means 90 becomes equal to or less than a predetermined value.</p> |
