MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

A multilayer electronic component, when an internal coil is formed to be perpendicular to insulating layers stacked in a ceramic body and external electrodes are formed on one surface (a lower surface) of a chip device facing a board at the time of being mounted on the board, a surface of a ceramic body to which the internal coil is exposed and on which the external electrodes are to be formed may be easily distinguished.

主权项

1. A multilayer electronic component, comprising:
a ceramic body including a plurality of stacked insulating layers; an internal coil part provided in the ceramic body and including electrical connections between respective coil patterns provided on the plurality of insulating layers, and having first and second lead out portions which are exposed to a same surface of the ceramic body perpendicular to the stacked insulating layers; a marking layer provided on an entire region of at least one surface of the ceramic body parallel to the stacked insulating layers; and first and second external electrodes provided on the same surface of the ceramic body perpendicular to the stacked insulating layers, and connected to the first and second lead out portions of the internal coil part, respectively.