发明名称 |
MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for semiconductor substrate, capable of improving life time of a minority carrier.SOLUTION: The manufacturing method for semiconductor substrate includes: forming a SiC substrate by a vapor growth method; introducing C (carbon) into the SiC substrate surface; and forming an n-type SiC layer on the SiC substrate by an epitaxial growth method. |
申请公布号 |
JP2015179787(A) |
申请公布日期 |
2015.10.08 |
申请号 |
JP20140057283 |
申请日期 |
2014.03.19 |
申请人 |
TOSHIBA CORP |
发明人 |
NISHIO JOJI;IIJIMA RYOSUKE;TAKAO KAZUTO;SHINOHE TAKASHI |
分类号 |
H01L29/861;H01L21/329;H01L21/336;H01L29/12;H01L29/739;H01L29/78;H01L29/868 |
主分类号 |
H01L29/861 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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