发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for semiconductor substrate, capable of improving life time of a minority carrier.SOLUTION: The manufacturing method for semiconductor substrate includes: forming a SiC substrate by a vapor growth method; introducing C (carbon) into the SiC substrate surface; and forming an n-type SiC layer on the SiC substrate by an epitaxial growth method.
申请公布号 JP2015179787(A) 申请公布日期 2015.10.08
申请号 JP20140057283 申请日期 2014.03.19
申请人 TOSHIBA CORP 发明人 NISHIO JOJI;IIJIMA RYOSUKE;TAKAO KAZUTO;SHINOHE TAKASHI
分类号 H01L29/861;H01L21/329;H01L21/336;H01L29/12;H01L29/739;H01L29/78;H01L29/868 主分类号 H01L29/861
代理机构 代理人
主权项
地址