METHOD FOR FORMING HIGH-DEFINITION METAL PATTERN, HIGH-DEFINITION METAL PATTERN, AND ELECTRONIC COMPONENT

摘要

Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

主权项

1. A method for forming a high-definition metal pattern, the method comprising the steps of:
(1) forming a receiving layer (A) on a substrate by coating the substrate with a resin composition (a), the resin composition (a) including a urethane resin (a1) having a weight-average molecular weight of five thousand or more or a vinyl resin (a2), and a medium (a3); (2) forming a plating-core pattern (B) on the receiving layer (A) by printing an ink (b) on the receiving layer (A) by reverse offset printing, the ink (b) including a particle (b1) that serves as a plating core; and (3) depositing a metal on the plating-core pattern (B) formed in the step (2) by electroless plating.