发明名称 SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCLUDING SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes an oxide semiconductor film, a source electrode, a drain electrode, a gate insulating film, a gate electrode, and an insulating film. The source electrode includes a region in contact with the oxide semiconductor film. The drain electrode includes a region in contact with the oxide semiconductor film. The gate insulating film is provided between the oxide semiconductor film and the gate electrode. The insulating film is provided over the gate electrode and over the gate insulating film. The insulating film includes a first portion and a second portion. The first portion includes a step portion. The second portion includes a non-step portion. The first portion includes a portion with a first thickness. The second portion includes a portion with a second thickness. The second thickness is larger than or equal to 1.0 time and smaller than or equal to 2.0 times the first thickness.
申请公布号 US2015287831(A1) 申请公布日期 2015.10.08
申请号 US201514677168 申请日期 2015.04.02
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 TANAKA Tetsuhiro;SAKURADA Yujiro;OKAZAKI Yutaka
分类号 H01L29/786;H01L23/29;H01L23/31 主分类号 H01L29/786
代理机构 代理人
主权项 1. A semiconductor device comprising: an oxide semiconductor film; a gate electrode; a source electrode in contact with the oxide semiconductor film; a drain electrode in contact with the oxide semiconductor film; a gate insulating film between the oxide semiconductor film and the gate electrode; and an insulating film over the gate electrode and the gate insulating film, the insulating film comprising a step portion and a non-step portion, wherein the step portion comprises a portion with a first thickness, wherein the non-step portion comprises a portion with a second thickness, and wherein the second thickness is larger than or equal to 1.0 time the first thickness and smaller than or equal to 2.0 times the first thickness.
地址 Atsugi-shi JP