| 发明名称 |
ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED Co2+ METAL ION REDUCING AGENT |
| 摘要 |
A solution for electroless deposition of platinum is provided. The solution comprises Co2+ ions, Pt4+ ions, and amine ligands. A ratio of Co2+ to Pt4+ ion is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer. |
| 申请公布号 |
US2015284857(A1) |
申请公布日期 |
2015.10.08 |
| 申请号 |
US201414243793 |
申请日期 |
2014.04.02 |
| 申请人 |
Lam Research Corporation |
发明人 |
NORKUS Eugenijus;STANKEVICIENE Ina;JAGMINIENE Aldona;TAMASAUSKAITE-TAMASIUNAITE Loreta;JOI Aniruddha;DORDI Yezdi |
| 分类号 |
C23C18/44;H01L21/768;C23C18/16 |
主分类号 |
C23C18/44 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solution for electroless deposition of platinum, comprising:
Co2+ ions; Pt4+ ions; and amine ligands. |
| 地址 |
Fremont CA US |
