发明名称 |
PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS |
摘要 |
In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die. |
申请公布号 |
WO2015152889(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
WO2014US32420 |
申请日期 |
2014.03.31 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, LP |
发明人 |
CHEN, CHIEN-HUA;CUMBIE, MICHAEL W;MOUREY, DEVIN A |
分类号 |
B41J2/16;B41J2/175 |
主分类号 |
B41J2/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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