POLISHING APPARATUS AND POLISHING METHOD

摘要

The present invention provides a polishing apparatus which inhibits decrease in the reproducibility of a polishing profile according to variation or the elapsed time at every shape maintaining ring of a maintaining ring of a substrate maintaining member. The polishing apparatus comprises: a polishing head (1) for compressing a substrate (W) to a polishing pad (101), and having a retainer ring (3) surrounding the substrate (W) compressed by the polishing pad (101); a measuring sensor (51) for measuring a surface shape of the retainer ring (3); and a control unit (500) for determining a polishing condition of the substrate (W) based on the surface shape of the retainer ring (3) measured by the measuring sensor (51).