| 摘要 |
The present invention is to provide a curable composition capable of enhancing surface hardness and scratch resistance of a cured product. The present invention is configured to manufacture the curable resin composition by blending a cationic curable silicon resin, which includes a silsesquioxane unit and more than 50 mole% of a monomer unit having an epoxy group in total monomer units, and also has a number average molecular weight of 1,000 to 3,000, with a leveling agent. In the total monomer units forming the cationic curable silicon resin, a ratio of the silsesquioxane unit represented by chemical formula (1): R^1SiO_3/_2, wherein R^1 is a group including an epoxy group, a hydrogen atom or a hydrocarbon group, may be more than 50 mole%. The cationic curable silicon resin may include an additional unit represented by a chemical formula (2): R^1SiO(OR^2), wherein R^1 is a group including the epoxy group, a hydrogen atom or a hydrocarbon group, and R^2 is a hydrogen atom or a C_1-4 alkyl group, and the silsesquioxane unit may have a mole% fivefold or more than the unit (2). |
