DIE-BONDING FILM, DIE-BONDING FILM WITH DICING SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

摘要

The present invention is to provide a die-bonding film which can reduce an influence due to a void even if the void is formed between the die-bonding film and a semiconductor chip or between the die-bonding film and an object to be bonded. Storage modulus E′1 of the die-bonding film is in a range of 0.1 to 10 MPa at 150°C before a heating process. The difference (E′2-E′1) between E′1 and E′2 is 5 MPa or lower, wherein E′2 is at 150°C after the heating for one hour at 150°C.