HEADPHONE

摘要

Various systems, processes, and techniques may be used to provide a headphone apparatus. In certain implementations, a headphone apparatus may include a headband and an earpiece that is supported by the headband. The headband may include two resilient conductive elements that are separated by an insulator. The conductive elements may provide a conductive path for an electrical signal or supply to the earpiece.

主权项

1. A headphone apparatus comprising:
a headband; and an earpiece supported by the headband, wherein the headband comprises two resilient conductive elements separated by an insulator, the conductive elements providing a conductive path for an electrical signal or supply to the earpiece.