| 发明名称 |
ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME |
| 摘要 |
An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. |
| 申请公布号 |
US2015287940(A1) |
申请公布日期 |
2015.10.08 |
| 申请号 |
US201514740006 |
申请日期 |
2015.06.15 |
| 申请人 |
LG CHEM, LTD. |
发明人 |
YOO Hyun Jee;CHO Yoon Gyung;CHANG Suk Ky;SHIM Jung Sup;LEE Suk Chin;JEONG Kwang Jin |
| 分类号 |
H01L51/00;C09J9/00;C09J11/04;C09J163/00 |
主分类号 |
H01L51/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An adhesive for encapsulating an organic electronic device (OED), comprising:
a curable resin, and a moisture absorbent, wherein the adhesive comprises a first region coming in contact with the organic electronic device (OED); and a second region not coming in contact with the organic electronic device (OED), and wherein the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. |
| 地址 |
Seoul KR |
