MOUNTING STRUCTURE FOR IC CHIP, RFID-ATTACHED PACKAGE, AND MOUNTING DEVICE FOR IC CHIP

摘要

PROBLEM TO BE SOLVED: To provide a structure capable of strongly mounting an IC chip on an object to be mounted.SOLUTION: A chip module 30 having an IC chip 32 and leads 34a and 34b connected to the IC chip 32 is mounted on the surface side of a package main body 20 having a metal sheet 24 formed with a slit SLT in a state where the IC chip 32 straddles the slit SLT via the leads 34a and 34b, and the leads 34a and 34b have a first portion arranged on the surface of the package main body 20 and a second portion arranged on the rear surface of the package main body 20 and a bent part formed between the first and second portions.