| 发明名称 |
HYBRID PRINTED CIRCUIT BOARD CONSTRUCTION |
| 摘要 |
A hybrid printed circuit board is described. The hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers. |
| 申请公布号 |
US2015289368(A1) |
申请公布日期 |
2015.10.08 |
| 申请号 |
US201414248108 |
申请日期 |
2014.04.08 |
| 申请人 |
FINISAR CORPORATION |
发明人 |
Daghighian Henry Meyer;Bird Steven C.;Babel Gerald Douglas |
| 分类号 |
H05K1/03;H05K1/09;H05K1/02 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A hybrid printed circuit board comprising:
a top layer; a bottom layer; a plurality of internal layers stacked up between the top layer and the bottom layer, the plurality of internal layers including a first internal layer below the top layer and a second internal layer above the bottom layer; first unreinforced laminate placed between the top layer and the first internal layer; second unreinforced laminate placed between the second internal layer and the bottom layer; and third laminate placed between adjacent internal layers of the plurality of internal layers. |
| 地址 |
Sunnyvale CA US |
