RESIN COMPOSITION FOR ORGANIC ELECTRONIC DEVICE ELEMENT ENCAPSULATION, RESIN SHEET FOR ORGANIC ELECTRONIC DEVICE ELEMENT ENCAPSULATION, ORGANIC ELECTROLUMINESCENT ELEMENT AND IMAGE DISPLAY DEVICE

摘要

A resin composition for organic electronic device element encapsulation, which is characterized by containing (A) a polyisobutylene resin, (B) a hydrogenated cyclic olefin resin and (C) a polymer which is obtained by means of radical polymerization, anionic polymerization or coordination polymerization and has rubber elasticity; a resin sheet which is obtained using this resin composition for organic electronic device element encapsulation; an organic electroluminescent element; and an image display device.