发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which hardly causes variation in electric characteristics due to microfabrication.SOLUTION: A semiconductor device includes: an oxide semiconductor film including a first region, a pair of second regions contacting with side surfaces of the first region, and a pair of third regions contacting with side surfaces of the pair of second regions; a gate insulation film provided on the oxide semiconductor film; and a first electrode overlapping with the first region on the gate insulation film. The first region is a c-axis aligned crystalline (CAAC) oxide semiconductor region, and the pair of second regions and the pair of third regions are amorphous oxide semiconductor regions including dopants. Dopant concentration of the pair of third regions is higher than that of the pair of second regions.
申请公布号 JP2015179878(A) 申请公布日期 2015.10.08
申请号 JP20150133763 申请日期 2015.07.02
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 H01L21/336;H01L21/8242;H01L21/8244;H01L27/10;H01L27/108;H01L27/11;H01L29/786 主分类号 H01L21/336
代理机构 代理人
主权项
地址