SEMICONDUCTOR PACKAGE

摘要

A semiconductor package includes a trace molding compound layer and a chip molding compound layer. The trace molding compound layer has a first surface and a second surface, wherein the trace molding compound layer encapsulates a plurality of traces and studs between the first and second surface. The chip molding compound layer has a first surface and a second surface, wherein the chip molding compound layer encapsulates a semiconductor chip between the first and second surface of the chip molding compound layer. The chip molding compound layer is disposed on the trace molding compound layer, the second surface of the chip molding compound layer adheres to the first surface of the trace molding compound layer, and the chip molding compound layer and the trace molding compound layer comprise substantially the same molding compound material.

主权项

1. A semiconductor package, comprising:
a trace molding compound layer having a first surface and a second surface opposite the first surface, wherein the trace molding compound layer encapsulates a plurality of traces and studs between the first and second surface of the trace molding compound layer, each of the plurality of traces having a trace upper surface and a trace lower surface opposite the trace upper surface, each of the plurality of studs having a stud upper surface and a stud lower surface opposite the stud upper surface, the trace upper surface is exposed on the first surface of the trace molding compound layer, the stud lower surface is exposed on the second surface of the trace molding compound layer and the stud upper surface adjoins the trace lower surface within the trace molding compound layer; and a chip molding compound layer having a first surface and a second surface opposite the first surface, wherein the chip molding compound layer encapsulates at least one semiconductor chip between the first and second surface of the chip molding compound layer;— wherein the chip molding compound layer is disposed on the trace molding compound layer, the second surface of the chip molding compound layer adheres to the first surface of the trace molding compound layer and the trace upper surface, and the chip molding compound layer and the trace molding compound layer comprise substantially the same molding compound material.