发明名称 |
HEAT RADIATION PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, BACKLIGHT UNIT INCLUDING THE SAME, AND LIQUID CRYSTAL DISPLAY DEVICE |
摘要 |
Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved. |
申请公布号 |
US2015289358(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
US201214367779 |
申请日期 |
2012.12.17 |
申请人 |
LG Innotek Co., Ltd. |
发明人 |
Park Hyun Gyu;Cho In Hee;Hong Seung Kwon;Kim Min Jae;Lee Hyuk Soo |
分类号 |
H05K1/02;H05K1/05;F21V8/00;H05K1/09 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Seoul KR |