发明名称 |
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASSOCIATED SYSTEMS AND METHODS |
摘要 |
Stacked semiconductor die assemblies having memory dies stacked between partitioned logic dies and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a first logic die, a second logic die, and a thermally conductive casing defining an enclosure. The stack of memory dies can be disposed within the enclosure and between the first and second logic dies. |
申请公布号 |
WO2015153664(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
WO2015US23677 |
申请日期 |
2015.03.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
LI, JIAN;GROOTHUIS, STEVEN, K. |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|