| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of achieving both of workability of a prepreg at normal temperature and suppression of void during molding, a film, a prepreg and a fiber-reinforced plastic using the same.SOLUTION: There is provided an epoxy resin composition containing following components (A), (B), (D) and (E). Component (A): an epoxy resin component having an oxazolidone ring structure in a molecule. (B) a bisphenol-type bifunctional epoxy resin component having a number average molecular weight of 600 to 1300 and no oxazolidone ring structure in a molecule. (D): one or more kind of triblock copolymer component selected from a triblock copolymer of poly(methyl methacrylate)/poly(butylacrylate)/poly(methyl methacrylate) and a triblock copolymer of poly(styrene)/poly(butadiene)/poly(methyl methacrylate). (E) one or more curing agent selected from dicyandiamide, diaminodiphenyl sulfone, imidazoles and boron chloride amine complex. |
