Thin Heat Transfer Device for Thermal Management

摘要

A thin design heat transfer device for thermal management is described herein. The heat transfer device uses a cold plate that is independent or “floating” relative to a spring mechanism employed to generate contact pressure with a heat-generating device. A bridge component associated with the spring mechanism is designed to span over the cold plate and contact the cold plate when the spring deforms, which therefore allows the cold plate to be independent of the spring mechanism. The independence between the cold plate and the spring mechanism enables deformation in the spring mechanism to drive contact pressure while eliminating or reducing corresponding deformation in the cold plate. Consequently, components of the heat transfer device may be made relatively thin and have less stiffness than traditional designs, but still provide acceptable contact pressure and quality for effective thermal management.

主权项

1. A heat transfer device (comprising:
a spring mechanism having a cutout to receive a cold plate, the cold plate configured to operate as a heat transfer surface for heat exchange with a heat-generating device; a spring bridge fastened to the spring mechanism and having a bridge portion configured to span the cold plate, the spring bridge configured to apply contact pressure to the cold plate responsive to deformation of the spring mechanism to affect engagement of the cold plate with the heat-generating device; and the cold plate situated within the cutout and underneath the bridge portion of the spring bridge, the cold plate being unattached to the spring mechanism and the spring bridge.