发明名称 |
CLEAVING METHOD FOR TEMPERED GLASS |
摘要 |
A cleaving method for tempered glass includes forming a scribe line in the tempered glass from a front surface side of the tempered glass in a thickness direction along a preset cleaving line, followed by cleaving the tempered glass with the scribe line being set as a boundary. The tempered glass includes a front surface-side compressive stress layer formed on the front surface side and having compressive stress applied thereto, a back surface-side compressive stress layer formed on a back surface side of the tempered glass in the thickness direction and having compressive stress applied thereto, and an intermediate tensile stress layer formed between the front and back surface-side compressive stress layers and having tensile stress applied thereto. The forming of the scribe line includes increasing a thickness of the front surface-side compressive stress layer at least in the vicinity of the preset cleaving line. |
申请公布号 |
US2015284284(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
US201314420161 |
申请日期 |
2013.08.07 |
申请人 |
Nippon Electric Glass Co., Ltd. |
发明人 |
Konishi Tomomi;Nakatsu Hiroyuki;Ichikawa Koji;Kunitomo Kazunobu;Takeuchi Hisahiro;Awazu Akira |
分类号 |
C03B33/02;C03B33/03 |
主分类号 |
C03B33/02 |
代理机构 |
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代理人 |
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主权项 |
1. A cleaving method for tempered glass, comprising forming a scribe line on a front surface side of the tempered glass along a preset cleaving line, followed by cleaving the tempered glass with the scribe line as a boundary,
the tempered glass comprising:
a front surface-side compressive stress layer being formed on the front surface side of the tempered glass in the thickness direction and having compressive stress applied thereto;a back surface-side compressive stress layer being formed on a back surface side of the tempered glass in the thickness direction and having compressive stress applied thereto; andan intermediate tensile stress layer being formed between the front surface-side compressive stress layer and the back surface-side compressive stress layer and having tensile stress applied thereto, the forming of the scribe line comprising increasing a thickness of the front surface-side compressive stress layer at least in the vicinity of the preset cleaving line. |
地址 |
Shiga JP |