发明名称 CLEAVING METHOD FOR TEMPERED GLASS
摘要 A cleaving method for tempered glass includes forming a scribe line in the tempered glass from a front surface side of the tempered glass in a thickness direction along a preset cleaving line, followed by cleaving the tempered glass with the scribe line being set as a boundary. The tempered glass includes a front surface-side compressive stress layer formed on the front surface side and having compressive stress applied thereto, a back surface-side compressive stress layer formed on a back surface side of the tempered glass in the thickness direction and having compressive stress applied thereto, and an intermediate tensile stress layer formed between the front and back surface-side compressive stress layers and having tensile stress applied thereto. The forming of the scribe line includes increasing a thickness of the front surface-side compressive stress layer at least in the vicinity of the preset cleaving line.
申请公布号 US2015284284(A1) 申请公布日期 2015.10.08
申请号 US201314420161 申请日期 2013.08.07
申请人 Nippon Electric Glass Co., Ltd. 发明人 Konishi Tomomi;Nakatsu Hiroyuki;Ichikawa Koji;Kunitomo Kazunobu;Takeuchi Hisahiro;Awazu Akira
分类号 C03B33/02;C03B33/03 主分类号 C03B33/02
代理机构 代理人
主权项 1. A cleaving method for tempered glass, comprising forming a scribe line on a front surface side of the tempered glass along a preset cleaving line, followed by cleaving the tempered glass with the scribe line as a boundary, the tempered glass comprising: a front surface-side compressive stress layer being formed on the front surface side of the tempered glass in the thickness direction and having compressive stress applied thereto;a back surface-side compressive stress layer being formed on a back surface side of the tempered glass in the thickness direction and having compressive stress applied thereto; andan intermediate tensile stress layer being formed between the front surface-side compressive stress layer and the back surface-side compressive stress layer and having tensile stress applied thereto, the forming of the scribe line comprising increasing a thickness of the front surface-side compressive stress layer at least in the vicinity of the preset cleaving line.
地址 Shiga JP