PRINTED CIRCUIT BOARD WIRE BONDING METHOD AND PRINTED CIRCUIT BOARD WIRE BONDING STRUCTURE FORMED BY SAME

摘要

The present invention relates to a printed circuit board wire bonding method and a printed circuit board wire bonding structure formed by the same. The printed circuit board wire bonding method, according to one specific embodiment, comprises the steps of: stacking a semiconductor chip on a substrate having an electrode; forming a metal pad on a predetermined portion of the electrode; and electrically connecting the semiconductor chip and the metal pad by using an aluminum wire, wherein the connecting comprises the steps of: forming a first bonding part by bonding a first end portion of the aluminum wire onto a predetermined portion of the semiconductor chip by using ultrasonic waves; and forming a second bonding part by bonding a second end portion of the aluminum wire onto a predetermined portion of the metal pad by using ultrasonic waves.