| 摘要 |
The present invention relates to a resin molding apparatus which discharges a liquid resin by supplying a compressed air to a nozzle. According to the resin molding apparatus, a resin supply hole (14), a resin discharge hole (15) and an air supply hole (16) are prepared in a front end of a dispenser (1). The resin supply hole (4) is connected to the resin discharge hole (15) by the medium of a resin path (22a) extended horizontally and a resin path (22b) extended vertically perpendicularly to the resin path (22a). The compressed air is supplied to the air supply hole (16) from a compressor (7) in a pressure P1 larger than a resin pressurizing pressure P0, and the liquid resin (2) is prevented from being inputted to the air supply hole (16). A small quantity of the liquid resin (2) is supplied to a cavity (12) by pushing out the liquid resin (2) remaining in the resin path (22b) from the resin discharge hole (15), by injecting the compressed air to the liquid resin (2) kept in the resin path (22b) by a pressure P2 larger than P1. |
