发明名称 HEAT RADIATOR OF ELECTRONIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a heat radiator of an electronic module which easily secures a heat radiation path of the pluggable electronic module and forms the good heat radiation path without sacrificing a mounting area of the module and placing the module in direct contact with a heat radiation member.SOLUTION: A heat radiator of an electronic module includes: a substrate 11; a cage 12 provided on the substrate and having an opening part at an upper part, the cage 12 which stores an electronic module so that the electronic module is inserted into or removed from a side part; a heat sink 13 fixed to the upper part of the cage and having a bottom part exposed to the interior of the cage from the opening part; and a flat spring 14 having a fixed end part fixed to the bottom part of the heat sink through a heat conduction sheet and a free end part bent in a cage inner direction by a bending part, the flat spring 14 in which the free end part contacts with an upper surface of the electronic module through the heat conduction sheet when the electronic module is stored in the cage 12.
申请公布号 JP2015179743(A) 申请公布日期 2015.10.08
申请号 JP20140056568 申请日期 2014.03.19
申请人 OKI ELECTRIC IND CO LTD 发明人 SAITO HISASHI;OKINO MASAHIRO;SAITO KENICHI;KITAI ATSUSHI;ARAI HIROYUKI
分类号 H01L23/40;H01L31/02;H01L33/00 主分类号 H01L23/40
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