| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state imaging apparatus which is capable of further improving light receiving sensitivity in each photoelectric conversion part, while suppressing the occurrence of color mixture between the photoelectric conversion parts laminated in a pixel.SOLUTION: The solid state imaging apparatus includes a first part which includes a first inorganic photoelectric conversion part, a semiconductor substrate part, and a microstructure. The semiconductor substrate part includes a light-receiving surface which faces the first inorganic photoelectric conversion part and on which light is made incident and a circuit forming surface on which a circuit including a read circuit is formed and a second inorganic photoelectric conversion part inside. The microstructure is arranged between the first inorganic photoelectric conversion part and the second inorganic photoelectric conversion part. |
