发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To improve electrical characteristics of a capacitive element.SOLUTION: A capacitive element CON forming a DRAM cell includes a lower electrode EL, a capacitive insulation film CINS formed on the lower electrode EL, and an upper electrode EU formed on the capacitive insulation film CINS. The upper electrode EU is structured by laminating a first upper electrode EU1, a second upper electrode EU2 and a third upper electrode EU3 in order from the side of the capacitive insulation film CINS. The third upper electrode EU3 is formed from a tungsten film containing impurities and between the first upper electrode EU1 and the third upper electrode EU3, the second upper electrode EU2 is interposed that is a barrier film for preventing the impurities in the third upper electrode EU3 from being diffused over the capacitive insulation film CINS.
申请公布号 JP2015179727(A) 申请公布日期 2015.10.08
申请号 JP20140056185 申请日期 2014.03.19
申请人 RENESAS ELECTRONICS CORP 发明人 SAKAMOTO MISATO;KATO YOSHITAKE;YAMAMOTO YOICHI;KASAI HITOSHI;ITO SATOSHI
分类号 H01L21/8242;H01L21/8234;H01L21/8238;H01L27/06;H01L27/088;H01L27/092;H01L27/108 主分类号 H01L21/8242
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