发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM
摘要 In a case where a solder amount of a solder portion printed on an electrode does not meet a reference amount, solder is additionally applied to a center position of the electrode by a control section. With respect to a component mounting position to which the solder is not additionally applied, correction from a component mounting position of a substrate to a corrected mounting position is performed and an electronic component is mounted at the corrected mounting position. The electronic component corresponding to another component mounting position with the solder additionally applied thereto is mounted at the design component mounting position in the positioned substrate.
申请公布号 US2015289426(A1) 申请公布日期 2015.10.08
申请号 US201314441275 申请日期 2013.11.15
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 Mantani Masayuki;Nishinaka Teruaki
分类号 H05K13/00;H05K13/04;B23K31/12;H05K3/34;B23K1/00;B23K1/20 主分类号 H05K13/00
代理机构 代理人
主权项 1. An electronic component mounting system comprising: a screen printing unit that prints solder on an electrode of a circuit substrate by screen printing; a solder position detection unit that detects a position of the solder printed on the electrode by the screen printing unit; a solder amount inspection unit that inspects an amount of the solder printed on the electrode by the screen printing unit; a mounting position correction unit that obtains a correction value of a mounting position of an electronic component based on the position of the solder detected by the solder position detection unit; an electronic component mounting unit that mounts the electronic component at a new component mounting position corrected based on the correction value obtained by the mounting position correction unit; and a solder application unit that additionally applies solder at a predetermined position of the electrode regardless of an actual position of the solder with respect to the electrode in which the amount of the solder is determined to be insufficient with respect to a predetermined reference value by the solder amount inspection unit, wherein with respect to the electronic component which is mounted on the electrode with the solder applied thereto by the solder application unit, the electronic component mounting unit mounts the electronic component at an original component mounting position without performing correction by the mounting position correction unit.
地址 Osaka JP
您可能感兴趣的专利