POWER MODULE

摘要

In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.

主权项

1. A power module comprising:
a heat dissipation substrate having one surface on which a power semiconductor element is mounted and a tilted part formed at an end portion thereof; a resin case surrounding said power semiconductor element, the resin case contacting said one surface of said heat dissipation substrate; a cooling fin contacting an opposite surface of said heat dissipation substrate; and pressure structure contacting said tilted part of said heat dissipation substrate to press said heat dissipation substrate against said cooling fin.