ON-SILICON LOW-LOSS TRANSMISSION LINES AND MICROWAVE COMPONENTS

摘要

A method of passive microwave component construction is disclosed. A metal conductor is sputtered on a silicon wafer to form a ground plane. A photoresist dielectric film is applied on top of the metal conductor. Photolithography is performed to construct a substrate structure using the photoresist. A metal conductor is sputtered through mask onto the substrate structure to form a top conductor. A development process is performed to remove unexposed photoresist leaving exposed photoresist between the top conduct and ground plane. A passive microwave component is also disclosed having a metal conductor on a silicon wafer providing a ground plane. A substrate deposited on the metal conductor formed during photolithography using a photoresist; and a top metal conduct on the narrow film substrate.