COPPER FOIL WITH CARRIER, PRINTED CIRCUIT BOARD, LAMINATE, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

Provided is a carrier attached copper foil having excellent circuit formability. According to the present invention, the carrier attached copper foil is sequentially made up by a carrier, a middle layer, and an electrode foil copper layer. The amount of moisture induced when heating the carrier attached copper foil by 30°C/min to 500°C is equal to or less than 160 ppm/g.