| 摘要 |
PROBLEM TO BE SOLVED: To provide a white curable material for an optical semiconductor device that is excellent in handleability, filling property into a mold during molding and continuous moldability.SOLUTION: The white curable material for an optical semiconductor device is either a white-colored curable composition or a heat-treated product produced by subjecting the white-colored curable composition to heat treatment. The white-colored curable composition includes an epoxy compound, a curing agent, titanium oxide, a filler different from titanium oxide and a curing accelerator. The white curable material for an optical semiconductor device has a softening point of not less than 60°C to less than 120°C, a viscosity at 170°C of more than 120 Pa s to not more than 300 Pa s and a gel time at 170°C of not less than 30 seconds to not more than 100 seconds, and when performing transfer molding by use of a mold under conditions of a molding temperature of 170°C and a molding time of 100 seconds and then taking the molded body out of the mold, the molded body has a Shore D hardness of 70 or more after 5 seconds from the time when the molded body has been taken out of the mold. |
