| 摘要 |
<p>PROBLEM TO BE SOLVED: To effectively pick up a semiconductor die while preventing the semiconductor die from being damaged.SOLUTION: A semiconductor die pickup device includes: a stage 20 including an adsorption face 22 for adsorbing a dicing sheet 12; a step surface forming mechanism 300 disposed within an opening 23 of the stage 20, including a plurality of mobile elements 30 which are moved between a first position where a distal end face is higher than the adsorption face 22, and a second position lower than the first position, and forming a step surface relative to the adsorption face 22; and an opening pressure switching mechanism 80 for switching an opening pressure of the opening 23 between a first pressure Papproximate to vacuum and a second pressure Papproximate to an atmospheric pressure. When picking up a semiconductor die 15, each time the opening pressure is switched from the first pressure Pto the second pressure P, at least one mobile element 30 is moved from the first position to the second position.</p> |
