| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A semiconductor device comprising: a first semiconductor chip provided with a first function, including a memory element but not including a peripheral circuit; first connection terminals provided in the first semiconductor chip; a second semiconductor chip provided with a second function, including a peripheral circuit but not including a memory element; and second connection terminals provided in the second semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip are stacked on one another by causing the first connection terminals and the second connection terminals to come into contact with one another. |
| 申请公布号 |
US2015287706(A1) |
申请公布日期 |
2015.10.08 |
| 申请号 |
US201314438118 |
申请日期 |
2013.09.13 |
| 申请人 |
SUKEKAWA Mitsunari |
发明人 |
Sukekawa Mitsunari |
| 分类号 |
H01L25/18;H01L27/108;H01L23/532;H01L23/528;H01L27/088;H01L23/48;H01L25/065;H01L23/544 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a first semiconductor chip provided with a first function, including a memory element but not including a peripheral circuit; first connection terminals provided in the first semiconductor chip; a second semiconductor chip provided with a second function, including a peripheral circuit but not including a memory element; and second connection terminals provided in the second semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip are stacked on one another by causing the first connection terminals and the second connection terminals to come into contact with one another. |
| 地址 |
US |
