发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor device and a manufacturing method thereof. The semiconductor device includes a semiconductor substrate (300) provided with a plurality of pads (301), columnar electrodes on the pads (301) and a solder ball (321) provided on the columnar electrode. The columnar electrode comprises a main body (307) and a groove in the main body (307), and an opening of the groove is overlapped with the top surface of the columnar electrode. The solder ball (321) comprises a metal bump (320) arranged on the top of the columnar electrode and a filling part (319) filled in the groove. The solder ball and the columnar electrode form a structure similar to a bolt; thus the binding force between the solder ball and the columnar electrode is improved. |
申请公布号 |
US2015287688(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
US201314440872 |
申请日期 |
2013.10.30 |
申请人 |
NANTONG FUJITSU MICROELECTRONICS CO., LTD. |
发明人 |
Lin Chang-Ming;Shi Lei;Tao Yujuan |
分类号 |
H01L23/00;H01L23/31 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Nantong, Jiangsu CN |