发明名称 |
PROCESSING DEVICE AND PROCESSING METHOD |
摘要 |
Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser output device having multiple vertical cavity surface-emitting laser elements that output laser light having a wavelength of 1070 nm or less, and a substrate on the surface of which the multiple vertical cavity surface-emitting laser elements are arranged in a matrix; a guidance optical system that guides the laser light output from the laser output device; and a control device that controls the output of the laser output device. |
申请公布号 |
WO2015151562(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
WO2015JP52073 |
申请日期 |
2015.01.26 |
申请人 |
MITSUBISHI HEAVY INDUSTRIES, LTD. |
发明人 |
GOYA, SANEYUKI;MUTA, KENJI;WATANABE, TOSHIYA;ISHIDE, TAKASHI |
分类号 |
B23K26/062;B23K26/00;B23K26/064;H01S5/42 |
主分类号 |
B23K26/062 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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