发明名称 PROCESSING DEVICE AND PROCESSING METHOD
摘要 Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser output device having multiple vertical cavity surface-emitting laser elements that output laser light having a wavelength of 1070 nm or less, and a substrate on the surface of which the multiple vertical cavity surface-emitting laser elements are arranged in a matrix; a guidance optical system that guides the laser light output from the laser output device; and a control device that controls the output of the laser output device.
申请公布号 WO2015151562(A1) 申请公布日期 2015.10.08
申请号 WO2015JP52073 申请日期 2015.01.26
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 GOYA, SANEYUKI;MUTA, KENJI;WATANABE, TOSHIYA;ISHIDE, TAKASHI
分类号 B23K26/062;B23K26/00;B23K26/064;H01S5/42 主分类号 B23K26/062
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