发明名称 |
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMANCE AND ASSOCIATED SYSTEMS AND METHODS |
摘要 |
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a stack of semiconductor dies and a thermally conductive casing at least partially enclosing the stack of semiconductor dies within an enclosure. A package substrate carries the thermally conductive casing, and an interposer is disposed between the thermally conductive casing and the stack of semiconductor dies. A peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies and is coupled to a plurality of conductive members interposed between the peripheral portion and the package substrate. |
申请公布号 |
WO2015153481(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
WO2015US23377 |
申请日期 |
2015.03.30 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
KOOPMANS, MICHAEL;LUO, SHIJIAN;HEMBREE, DAVID, R. |
分类号 |
H01L23/34;H01L23/48 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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