COVERLAY FOR HIGH-FREQUENCY CIRCUIT SUBSTRATE

摘要

To provide a coverlay for a high-frequency circuit substrate, that uses polyimide film and fluororesin, has excellent mechanical properties and heat resistance, and can increase workability during the manufacture of high-frequency circuit substrates. Resolution Means: The coverlay for a high-frequency circuit substrate including a polyimide film and a fluororesin bonded together, and an adhesive strength between the polyimide film layer and the fluororesin layer being greater than 3.0 N/cm.